ICMA 2011 - IEEE ICMA

picture

IEEE ICMA 2011 Conference

Plenary Talk 3

CSEM: Vertical integration of R&D in Micro and Nanosystems for optimal application in industrial applications

George Kotrotsios
Doctor
Vice President
Business Developpement
CSEM SA, Swiss Center for Electronics and Microtechnology
Jaquet Droz 1, CH-2002, Neuchatel, Switzerland
E-mail georges.kotrotsios@csem.ch

Abstract:

Micro and Nanotechnologies have evolved as the heritage of the Swiss Watch industry and its traditional competencies. This activity has been verticalized over the years from design to manufacturing, characterization and integration for specific applications. This vertical integration has been extremely useful for the industry. Design concerns two types of activities, which are (1) design of the microsystem and (2) design of specific surface properties, as for instance Zero Order Diffraction gratings, diamond selfassembled structures, where our nanotechnology capabilities are required. In terms of design structuring of Silicon, Polymer or more exotic materials as ceramics and even metals. Microelectronic techniques as DRIE are heavily used. One of the most complete X-Ray characterization labs brings the necessary quality, required by industrial applications. Over the some last years a number of successful applications have been served, including mechanical pieces for watch industry, MEMS for medical applications (actuating mechanisms and sensors), innovative MOEMS for tunable lasers and spectrometers, or chemical sensors for environmental monitoring.

George Kotrotsios  holds a Ph.D. Degree in Optoelectronics, Institut National Polytechnique de Grenoble (Fr), an Executive MBA in Management of Technology, HEC, Universit√© de Lausanne (CH) and an Electrical Engineering Degree from the Aristotle University of Thessaloniki (Gr). He conducted several years applied R&D in the field of optical fiber communications and sensors as well on fiber manufacturing technology, fiber lasers, surface engineering, nanotechnologies (having developed the first commercial European Atomic Force Microscope - AFM), since 1985. His activities gradually and steadily moved from pure R&D to R&D management and towards the process of creating economic value out of technology. Between 1996 and 1999, M3D SA, a contract research organisation, a joint venture of Mitsubishi Co and Battelle. He developed a new start-up on fiber optic sensors. Thereafter he created two other start-ups in optical communications. He joined again CSEM at the end of 1999 focusing the commercialisation of micro-nanotechnologies and ICT of the company in a large spectrum of markets. He is in charge of the Marketing and Business Development of the company since April 2005. From January 1st , 2010 he is in member of the Executive Committee of CSEM, in charge of Business Development, Technology Commercialisation and Strategic Relations, including European Commission and European Space Agency.

Presently, G. Kotrotsios is President Board of Directors of Sensecore (active in wearable for elite athletes). He is also on the Executive Board of Earto, the European Association of Research and Technology Organisations, and member of the Experts Committee of Micronarc, the Microsystem and Association in Western Switzerland.

He has published numerous articles in peer reviewed journals as well as in conferences. He is one of the co-authors of the Genessys, the European White paper on Nanotechnology. In addition, he is member of the Scientific Committee of numerous conferences Member of the International Advisory Board of the EuroNanoForum 2011, in Prague, Czech Republic. He is acting as a reviewer in major scientific reviews (Optics Letters, Applied Optics) as well as expert for national and international projects.

National Natural Science Foundation of China Beijing University of Technology Kagawa University The Robotics Society of Japan The Japan Society of Mechanical Engineers Japan Society for Precision Engineering The Society of Instrument and Control Engineers Harbin Engineering University University of Electronic Science and Technology of China University of Electro-Communications Changchun University of Science and Technology Intelligent Manufacturing Systems